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Compact LTCC-Integrated Fully Decoupled Biasing for Wireless Sensors

  • École de technologie supérieure

Research output: Contribution to Book/Report typesContribution to conference proceedingspeer-review

Abstract

This paper presents the design, simulation, fabrication, and measurement of a compact bias-tee fully embedded in an LTCC substrate suitable for wireless sensor applications. The structure features two parallel-plate capacitors, one at each RF port, and a centrally placed inductor for DC injection, providing complete DC isolation while maintaining RF continuity. Unlike conventional bias-tees, this configuration isolates both RF ports from DC bias, making it ideal for sensitive RF front-ends and embedded sensor systems. Simulated and measured S-parameters confirm excellent RF performance with low insertion loss and high isolation. The device was fabricated using DuPont 951 LTCC, and its internal structure was validated using X-ray imaging. This embedded bias-tee enables reliable, compact integration in multi-functional sensor systems, supporting co-packaged RF components and minimizing interference in high-density multi-layered devices and circuits.

Original languageEnglish
Title of host publicationIEEE SENSORS 2025 - Conference Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9798331544676
DOIs
Publication statusPublished - 2025
Event2025 IEEE SENSORS - Vancouver, Canada
Duration: 19 Oct 202522 Oct 2025

Publication series

NameProceedings of IEEE Sensors
ISSN (Print)1930-0395
ISSN (Electronic)2168-9229

Conference

Conference2025 IEEE SENSORS
Country/TerritoryCanada
CityVancouver
Period19/10/2522/10/25

!!!Keywords

  • bias-tee
  • LTCC
  • MEMS
  • monolithic fabrication
  • wireless sensors

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