Numerical Simulation and Experimental Study of the Thermal Wick-Debinding Used in Low-Pressure Powder Injection Molding

Thermal wick-debinding, commonly used in low-pressure injection molding, remains challenging due to complex interactions between binder transport, capillary forces, and thermal effects. This study presents a numerical simulation of binder removal kinetics by coupling Darcy’s law with the Phase Transport in Porous Media interface in COMSOL Multiphysics. The model was validated and subsequently used to study the influence of key debinding parameters. Contrary to the Level Set method, which predicts isolated binder clusters, the Multiphase Flow in Porous Media method proposed in this work more accurately reflects the physical behavior of the process, capturing a continuous binder extraction throughout the green part and a uniform binder distribution within the wicking medium. The model successfully predicted the experimentally observed decrease in binder saturation with increasing debinding temperature or time, with deviation limited 3–10 vol. % (attributed to a mandatory brushing operation, which may underestimate the residual binder mass). The model was then used to optimize the debinding process: for a temperature of 100 °C and an inter-part gap distance of 5 mm, the debinding time was minimized to 7 h. These findings highlight the model’s practical utility for process design, offering a valuable tool for determining optimal debinding parameters and improving productivity.