TY - GEN
T1 - Compact LTCC-Integrated Fully Decoupled Biasing for Wireless Sensors
AU - Fallah Nia, Ehsan
AU - Kouki, Ammar
N1 - Publisher Copyright:
© 2025 IEEE.
PY - 2025
Y1 - 2025
N2 - This paper presents the design, simulation, fabrication, and measurement of a compact bias-tee fully embedded in an LTCC substrate suitable for wireless sensor applications. The structure features two parallel-plate capacitors, one at each RF port, and a centrally placed inductor for DC injection, providing complete DC isolation while maintaining RF continuity. Unlike conventional bias-tees, this configuration isolates both RF ports from DC bias, making it ideal for sensitive RF front-ends and embedded sensor systems. Simulated and measured S-parameters confirm excellent RF performance with low insertion loss and high isolation. The device was fabricated using DuPont 951 LTCC, and its internal structure was validated using X-ray imaging. This embedded bias-tee enables reliable, compact integration in multi-functional sensor systems, supporting co-packaged RF components and minimizing interference in high-density multi-layered devices and circuits.
AB - This paper presents the design, simulation, fabrication, and measurement of a compact bias-tee fully embedded in an LTCC substrate suitable for wireless sensor applications. The structure features two parallel-plate capacitors, one at each RF port, and a centrally placed inductor for DC injection, providing complete DC isolation while maintaining RF continuity. Unlike conventional bias-tees, this configuration isolates both RF ports from DC bias, making it ideal for sensitive RF front-ends and embedded sensor systems. Simulated and measured S-parameters confirm excellent RF performance with low insertion loss and high isolation. The device was fabricated using DuPont 951 LTCC, and its internal structure was validated using X-ray imaging. This embedded bias-tee enables reliable, compact integration in multi-functional sensor systems, supporting co-packaged RF components and minimizing interference in high-density multi-layered devices and circuits.
KW - bias-tee
KW - LTCC
KW - MEMS
KW - monolithic fabrication
KW - wireless sensors
UR - https://www.scopus.com/pages/publications/105034059750
U2 - 10.1109/SENSORS59705.2025.11330442
DO - 10.1109/SENSORS59705.2025.11330442
M3 - Contribution to conference proceedings
AN - SCOPUS:105034059750
T3 - Proceedings of IEEE Sensors
BT - IEEE SENSORS 2025 - Conference Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2025 IEEE SENSORS
Y2 - 19 October 2025 through 22 October 2025
ER -