Balancing thermal conductivity, dielectric, and tribological properties in polyamide 1010 with 2D nanomaterials

Keyphrases

• 2D Nanomaterials 100%
• Bio-based Polyamide 50%
• Dielectric Properties 100%
• Electrical Conductivity 50%
• Electrical Insulation 50%
• Electronic Packaging Materials 50%
• Energy Efficiency 50%
• Friction 50%
• Friction Coefficient 50%
• Graphene Oxide 50%
• Heat Dissipation 50%
• Hexagonal Boron Nitride (h-BN) 50%
• High Temperature 50%
• High Thermal Conductivity 100%
• Hybrid Composites 50%
• Hybrid System 50%
• Intrinsic Dielectric Properties 50%
• Low Friction 50%
• Low-friction Materials 50%
• Mechanical Performance 50%
• Melt Blending 100%
• Molybdenite 50%
• Nanofillers 50%
• Polyamide 100%
• Polyamide 1010 100%
• Polymer Dielectrics 50%
• Polymer Nanocomposites 50%
• Synergistic Effect 100%
• Thermal Conductivity 50%
• Thermal Conductivity Properties 100%
• Thermal Interface Materials 50%
• Tribological Properties 100%
• Two Dimensional Structure 50%
• Ultra-low 50%

Material Science

• 2D Nanomaterials 100%
• Boron Nitride 25%
• Composite Material 25%
• Dielectric Material 100%
• Dielectric Property 25%
• Electrical Conductivity 25%
• Friction Material 25%
• Graphene Oxide 25%
• Interface (Material) 25%
• Molybdenum 25%
• Nanocomposite 50%
• Packaging Material 25%
• Polyamide 100%
• Polymer Nanocomposites 25%
• Thermal Conductivity 100%